Problems Encountered In PCBA Manufacturability

Since the 1990s, the electronic field has developed rapidly; Meanwhile, the design, development and marketing of various products have entered a brand new period. Electronic product designers face unprecedented severe challenges; Customers demand lower prices, higher product quality and shorter delivery times. How to design products with more functions, smaller size, higher cost performance, and meeting customer needs to the greatest extent has become the goal of circuit designers. Due to long-term thinking and operating formulas, there is always a “gap” between product development and manufacturing. Designed products often face the following problems.
 PCBA Manufacturability
1. It does not meet the requirements of PCBA manufacturing capacity and requires a great number of maintenance work, resulting in low product quality and product design changes.
2. Products cannot be manufactured at all, PCB designers must start from scratch, wasting a lot of manpower and material resources, and seriously weakening the competitiveness of enterprises in the same industry.
3. Poor product reliability, many customer complaints, large investment in after-sales service, the enterprise cannot make ends meet, and the product life cycle is shortened, which ultimately leads to unsustainable enterprises.
Various problems are related to the manufacturability of Printed Circuit Board Assembly, which is an important factor that must be considered in the design of modern electronic products.
Grande PCBA Capacity
1. The largest board: 310mm*410mm (SMT);
2. Maximum board thickness: 3mm;
3. Minimum board thickness: 0.5mm;
4. The smallest Chip parts: 0201 package or parts above 0.6mm*0.3mm;
5. The maximum weight of mounted parts: 150 grams;
6. Maximum part height: 25mm;
7. Maximum part size: 150mm*150mm;
8. Minimum lead part spacing: 0.3mm;
9. The smallest spherical part (BGA) spacing: 0.3mm;
10. The smallest spherical part (BGA) diameter: 0.3mm;
11. Maximum component placement accuracy (100QFP): 25um@IPC;
12. Mounting capacity: 3 to 4 million points/day.

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