In integrated circuits, excessive temperature can negatively affect the function, components and the board itself. What are the reason of severe heating of the PCB board?
PCB board heating serious reason
1. Incorrect component placement
Some high-power devices need to be reserved for natural ventilation or forced ventilation for heat dissipation. Without proper airflow heat dissipation, the PCB will accumulate most of the heat, resulting in higher temperatures, which can lead to degraded or damaged circuit performance. It is important to note that sensitive components should not be placed near components that generate a lot of heat; with proper heat dissipation and natural or forced cooling, the temperature can be kept within a safe range.
2. Environmental and external thermal factors
PCB used in extreme temperature environments may result in excessive stress on electronic components if the design does not take into account the temperature conditions of the target environment; Usually, electronic component manufacturers provide specifications that apply to a specific temperature range.
3. Wrong part and material selection
Failure to follow recommended guidelines in the selection of materials for electronic components can lead to thermal problems. When selecting electronic components, it is important to review detailed data and consider all relevant information related to power consumption, thermal resistance, temperature limitations, and cooling techniques. In addition, perform a quick power calculation on the resistors to ensure that the right power rating is selected for the application. Another issue is the choice of PCB dielectric material. The PCB itself must be able to withstand the worst thermal conditions.
4, PCB design and manufacturing defects
Poor layout and manufacturing processes can lead to PCB heat dissipation problems. Improper soldering may hinder heat dissipation, and insufficient wiring width or copper area may also lead to higher temperatures. To prevent heat dissipation, designers must reduce heat dissipation and use other heat dissipation techniques when natural heat dissipation is insufficient; for thermally optimized designs, attention should be paid to component specifications, PCB layout, PCB dielectric materials and environmental conditions.